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rev. 0.95 11/13 copyright ? 201 3 by silicon laboratories si7013 this information applies to a product under dev elopment. its characteristics and specifications are s ubject to change without n otice. si7013 i 2 c h umidity and t wo -z one t emperature s ensor features applications description the si7013 i 2 c humidity and 2-zone temperat ure sensor is a monolithic cmos ic integrating humidity and temperatur e sensor elements, an analog-to-digital converter, signal processing, calibration data, and an i 2 c interface. the patented use of industry-standard, low-k polymeric dielectrics for sensing humidity enables the construction of low-power, monolithi c cmos sensor ics with low drift and hysteresis, and excellent long term stability. the humidity and temperature sensors ar e factory-calibrated and the calibration data is stored in the on-chip non-volatile memory. this ensures that the sensors are fully interchangeable, with no recalibration or software changes required. an auxiliary sensor input with power management can be tied directly to an external thermistor network or other voltage-output sensor. on-board logic performs calibration/linearization of the external input using user-programmable coefficients. the least-significant bit of the si7013's i 2 c address is programmable, allowing two devices to share the same bus. the si7013 is available in a 3x3 mm dfn package and is reflow solderable. the optional factory-installed cove r offers a low profile, convenient means of protecting the sensor during assembly (e.g., reflow soldering) and throughout the life of the product, excluding liquids (hydro phobic/oleophobic) and particulates. the si7013 offers an accurate, low-power, factory-calibrated digital solution ideal for measuring humidity, dew-point, and te mperature, in applications ranging from hvac/r and asset tracking to industrial and consumer platforms. ? precision relative humidity sensor ?? 3% rh (max), 0?80% rh ? high accuracy temperature sensor ?? 0.4 c (max), ?10 to 85 c ? 0 to 100% rh operating range ? up to ?40 to +125 c operating range ? low voltage operation (1.9 to 3.6 v) ? low power consumption ?? 150 a active current ?? 60 na standby current ? factory-calibrated ? i 2 c interface ? integrated on-chip heater ? auxiliary sensor input ?? direct readout of remote thermistor temperature in c ? package: 3x3 mm dfn ? excellent long term stability ? optional factory-installed cover ?? low-profile ?? protection during reflow ?? excludes liquids and particulates ? hvac/r ? thermostats/humidistats ? instrumentation ? white goods ? micro-environments/data centers ? industrial controls ? indoor weather stations patent protected. patents pending ordering information: see page 35. pin assignments si7013 sda gndd vsns ad0/vout gnda vinp vddd scl vinn vdda 1 2 3 4 56 7 8 9 10 top view
si7013 2 rev. 0.95 functional block diagram adc gnd humidity sensor control logic scl si7013 temp sensor 1.25v ref i 2 c interface sda ad0/vout vsns vdd vinp calibration memory analog input vinn
si7013 rev. 0.95 3 t able of c ontents section page 1. electrical specificat ions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 2. typical application ci rcuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 3. bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.1. relative humidity sens or accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.2. hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 4.3. prolonged exposure to high humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 4.4. pcb assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.5. protecting the sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.6. bake/hydrate procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.7. long term drift/aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5. i2c interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.1. issuing a measurement command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2. reading and writing user registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.3. measuring analog voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.4. nonlinear correction of voltage inputs: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.5. firmware revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.6. heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 5.7. electronic serial number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 6. control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 6.1. register descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7. pin descriptions: si7013 (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8. ordering guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 9. package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.1. package outline: 3x3 10-pin dfn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9.2. package outline: 3x3 10-pin df n with protective cover . . . . . . . . . . . . . . . . . . . . . 38 10. pcb land pattern and solder mask d esign . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 11. top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 11.1. si7013 top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 11.2. top marking explana tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 12. additional reference resour ces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 document change list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 contact information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
si7013 4 rev. 0.95 1. electrical specifications unless otherwise specified, all mi n/max specifications apply over the recommended operating conditions. table 1. recommended operating conditions parameter symbol test condition min typ max unit power supply v dd 1.9 ? 3.6 v operating temperature t a i and y grade ?40 ? +125 c operating temperature t a g grade ?40 ? +85 c table 2. general specifications 1.9 < v dd < 3.6 v; t a = ?40 to 85 c (g grade) or ?40 to 125 c (i/y grade); default conversion ti me unless otherwise noted. parameter symbol test condition min typ max unit input voltage high v ih ad0, scl, sda, vsns pins 0.7xv dd ??v input voltage low v il ad0, scl, sda, vsns pins ? ? 0.3xv dd v input voltage range v in scl, sda, rstb pins with respect to gnd 0.0 ? v dd v input leakage i il scl, sda pins; v in =gnd ? ? 1 a vsns pin (200k nominal pull up); vin = gnd 5xv dd a output voltage low v ol sda pin; i ol = 2.5 ma; v dd = 3.3 v ? ? 0.6 v sda pin; i ol =1.2ma; v dd =1.9v ??0.4v output voltage high v oh vout pin, i oh = ?0.5 ma, v dd =2.0v v dd ? 0.2 ? ? v vout pin, i oh = ?10 av dd ? 0.1 ? ? v vout pin, i oh = ?1.7 ma, v dd =3.0v v dd ? 0.4 ? ? v current consump- tion i dd rh conversion in progress ? 150 180 a temperature conversion in progress ? 90 120 a standby, ?40 to +85 c 2 ?0.060.62 a standby, ?40 to +125 c 2 ?0.063.8 a peak idd during powerup 3 ?3.54.0ma peak idd during i 2 c operations 4 ?3.54.0ma heater current 5 i heat ? 3.1 to 94.2 ? ma notes: 1. initiating a rh measurement will also automatically initiate a temperature measurement. the total conversion time will be t conv (rh) + t conv (t). 2. no conversion or i 2 c transaction in progress. typical values measured at 25 c. 3. occurs once during poweru p. duration is <5 msec. 4. occurs during i 2 c commands for reset, read/write user registers, read eid, read firmware version, read/write thermistor coefficients and read thermistor. duration is <50 s for all commands except read thermistor, which has <150 s duration. 5. additional current consumption when htre bit enabled . see section ?5.6. heate r? for more information.
si7013 rev. 0.95 5 conversion time 1 t conv rh or voltage normal ? 5.8 7 ms rh or voltage fast ? 2.6 3.1 ms temp normal ? 4 4.8 ms temp fast ? 1.5 1.8 ms powerup time t pu from v dd 1.9 v to ready for a conversion, 25 c ?1825ms from vdd 1.9 v to ready for a conversion, full temperature range ??80ms table 3. i 2 c interface specifications 1 1.9 ? v dd ? 3.6 v; t a = ?40 to +85 c (g grade) or ?40 to +125 c (i/y grade) unless otherwise noted. parameter symbol test condition min typ max unit hysteresis v hys high-to-low versus low-to- high transition 0.05 x v dd ??v sclk frequency 2 f scl ? ? 400 khz scl high time t skh 0.6 ? ? s scl low time t skl 1.3 ? ? s start hold time t sth 0.6 ? ? s start setup time t sts 0.6 ? ? s stop setup time t sps 0.6 ? ? s bus free time t buf between stop and start 1.3 ? ? s sda setup time t ds 100 ? ? ns sda hold time t dh 100 ? ? ns notes: 1. all values are referenced to v il and/or v ih . 2. depending on the conversion command, the si7013 may hold t he master during the conversion (clock stretch). at above 300 khz scl, the si7013 may hold the master briefly fo r user register and device id transactions. at the highest i 2 c speed of 400 khz the stretching will be <10 s. 3. pulses up to and including 50ns will be suppressed. table 2. general specifications (continued) 1.9 < v dd < 3.6 v; t a = ?40 to 85 c (g grade) or ?40 to 125 c (i/y grade); default conversion ti me unless otherwise noted. parameter symbol test condition min typ max unit notes: 1. initiating a rh measurement will also automatically initiate a temperature measurement. the total conversion time will be t conv (rh) + t conv (t). 2. no conversion or i 2 c transaction in progress. typical values measured at 25 c. 3. occurs once during poweru p. duration is <5 msec. 4. occurs during i 2 c commands for reset, read/write user registers, read eid, read firmware version, read/write thermistor coefficients and read thermistor. duration is <50 s for all commands except read thermistor, which has <150 s duration. 5. additional current consumption when htre bit enabled . see section ?5.6. heate r? for more information.
si7013 6 rev. 0.95 figure 1. i 2 c interface timing diagram sda valid time t vd;dat from scl low to data valid ? ? 0.9 s sda acknowledge valid time t vd;ack from scl low to data valid ? ? 0.9 s suppressed pulse width 3 t sps 50 ? ? ns table 3. i 2 c interface specifications 1 1.9 ? v dd ? 3.6 v; t a = ?40 to +85 c (g grade) or ?40 to +125 c (i/y grade) unless otherwise noted. parameter symbol test condition min typ max unit notes: 1. all values are referenced to v il and/or v ih . 2. depending on the conversion command, the si7013 may hold t he master during the conversion (clock stretch). at above 300 khz scl, the si7013 may hold the master briefly fo r user register and device id transactions. at the highest i 2 c speed of 400 khz the stretching will be <10 s. 3. pulses up to and including 50ns will be suppressed. scl d7 1/f scl t skh sda t skl t sth d6 d5 d0 r/w ack t ds t dh start bit stop bit t buf t sts t vd : ack t sps t sp
si7013 rev. 0.95 7 table 4. humidity sensor 1.9 v dd 3.6 v; t a = 30 c; default conversion time unless otherwise noted. parameter symbol test condition min typ max unit operating range 1 non-condensing 0 ? 100 %rh accuracy 3, 4 0 ? 80% rh ? 2 3 %rh 80 ? 100% rh see figure 2 %rh repeatability-noise 12-bit resolution ? 0.025 ? %rh rms 11-bit resolution ? 0.05 ? %rh rms 10-bit resolution ? 0.1 ? %rh rms 8-bit resolution ? 0.2 ? %rh rms response time 5 63% 1m/s airflow ? 18 ? s drift vs. temperature ? 0.05 ? %rh/c hysteresis ? 1 ? %rh long term stability 4 ?< 0.25 ? %rh/yr notes: 1. recommended humidity operating range is 20% to 80% rh (non-condensing) over ?10 c to 60 c. prolonged operation beyond these ranges may result in a shift of sensor reading with slow recovery time. 2. see conversion time specifications in table 2. 3. excludes hysteresis, long term drift, and certain other fact ors and is applicable to non-condensing environments only. see section ?4.1. relative humidity sensor accuracy? for more details. 4. drift due to aging effects at typical room conditions of 30c and 30% to 50% rh. may be impacted by dust, vaporized solvents or other contaminants, e.g., out-gassing tapes, a dhesives, packaging materials, etc. see section ?4.7. long term drift/aging? 5. response time to a step change in rh. time for the rh output to change by 63% of the total rh change.
si7013 8 rev. 0.95 figure 2. rh accuracy at 30 c
si7013 rev. 0.95 9 figure 3. temperature accuracy* *note: applies only to i and y devices beyond +85 c. table 5. temperature sensor 1.9 v dd 3.6 v; t a = ?40 to +85 c (g grade) or ?40 to +125 c (i/y gr ade), default conversion ti me unless otherwise noted. parameter symbol test condition min typ max unit operating range i and y grade ?40 ? +125 c g grade ?40 ? +85 c accuracy 1 ?10 c < t a < 85 c ? 0.3 0.4 c ?40 c < t a < 125 c figure 3 c repeatability-noise 14-bit resolution ? 0.01 ? c rms 13-bit resolution ? 0.02 ? c rms 12-bit resolution ? 0.04 ? c rms 11-bit resolution ? 0.08 ? c rms response time 2 63% unmounted device ? 0.7 ? s si7013-eb board ? 5.1 ? s long term stability ? < 0.01 ? c/yr notes: 1. 14b measurement resolution (default). 2. time to reach 63% of final value in response to a step change in temperature. actual response time will vary dependent on system thermal mass and airflow.
si7013 10 rev. 0.95 table 6. voltage converter specifications 1.9 v dd 3.6 v; t a = ?40 to +85 c (g grade) or ?40 to +125 c (y grade); default conversion time, v ref = 1.25 v internal or v dda , buffered and unbuffered mo de, unless otherwise noted. parameter symbol test condition min typ max unit resolution ? v ref / 32768 ?v integral non-linearity inl |vinp-vinn| < v ref /2 ? 1 ? lsb differential non-linearity dnl |vinp-vinn| < v ref /2 ? 1 ? lsb noise n |vinp-vinn| < v ref /2, v ref =1.25v ?25?v rms input offset (buffered mode) v os |vinp-vinn| = 0 ? ? 10 mv input offset (unbuffered mode) v os |vinp-vinn| = 0 ? ? 1 mv gain accuracy ? gv ref = 1.25 v; gain is absolute ? + 1+ 2% v ref =v dd ; gain is relative to v dd ?+ 0.25 + 0.5 % notes: 1. in unbuffered mode, r in *c in should be < 0.5usec. c in minimum is around 10 pf. 2. in buffered mode, vinp and vinn must be > 0.5 v and < v dd for best performance.
si7013 rev. 0.95 11 table 7. thermal characteristics parameter symbol test condition dfn-6 unit junction to air thermal resistance ? ja jedec 2-layer board, no airflow 236 c/w junction to air thermal resistance ? ja jedec 2-layer board, 1 m/s airflow 203 c/w junction to air thermal resistance ? ja jedec 2-layer board, 2.5 m/s airflow 191 c/w junction to case thermal resistance ? jc jedec 2-layer board 20 c/w junction to board thermal resistance ? jb jedec 2-layer board 112 c/w table 8. absolute maximum ratings 1 parameter symbol test condition min typ max unit ambient temperature under bias ?55 ? 125 c storage temperaturefigure 2 ?65 ? 150 c voltage on i/o pins ?0.3 ? vdd+0.3v v voltage on vdd with respect to gnd ?0.3 ? 4.2 v notes: 1. absolute maximum ratings are stress ratings only, operation at or beyond these conditio ns is not implied and may shorten the life of the device or alter its performance. 2. special handling considerations apply; see application note, ?an607: si70xx humidity sensor designer?s guide? for details.
si7013 12 rev. 0.95 2. typical application circuits the primary function of the si7013 is to measure relati ve humidity and temperature. figure 4 demonstrates the typical application circuit to achieve th ese functions; pins 6 and 7 are not required and should be left unconnected. figure 4. typical application circuit for relative humidity and temperature measurement the application circuit shown in figure 5 uses the auxilia ry analog pins for measuring a remote temperature using a thermistor. figure 5. typical application circuit for thermistor interface with ad0 = 1 the voltage connected at vdda serves as the reference voltage for both the analog-to-digital converter and the resistor string. therefore, the adc must be configured to take its reference from vdda. the top of the resistor string is connected to the vout pin, allowing the resistor string to be powered down, saving power between temperature conversions. in this mode of operation, the analog inputs are buffered and present an input impedance of > 100 k ?? ?) *1'' 9 ''$ 6&/ 6'$ 6l 6&/ 6'$ wr9 *1'$ 9 ''' 9616 $'9287 9,13 9,11 n n c1 0.1f gndd v ddd scl sda si7013 scl sda 1.9v to 3.6v ad0/vout vinp vinn c2 0.1f r3 24k ? r4 24k ? th1 10k ? ntc v dda gnda 10 1 9 8 2 6 7 3 4 5 rst r1 10k ? r2 10k ? c3 0.1f
si7013 rev. 0.95 13 the ad0/vout pin is a dual function pin. at powerup, it functions as an a ddress select pin and selects the least significant i 2 c figure 5, the ad0/vout pin is pulled high, sele cting ad0 = 1. in figure 6, the ad0/vout pin is pulled low selecting ad0 = 0. figure 6. typical application circuit for thermistor interface with ad0 = 0 figure 7. typical application circuit for single ended 0 to 3 v measurement figure 7 demonstrates a single ended 0 to 3 v input range configuration. the voltage reference is the internal 1.25 v reference. the 1 k ? and 2 k ? resistor divider keeps the voltage range to 1.0 v, which is within the recommended 80% of v ref . full scale of 32767 counts is 3.75 v. c1 0.1f gndd v ddd scl sda si7013 scl sda 1.9 to 3.6v ad0/vout vinp vinn c2 0.1f r3 24k ? r4 24k ? v dda gnda 10 1 9 8 2 6 7 3 4 5 rst r1 10k ? r2 10k ? th1 10k ? ntc & ?) *1'' 9 ''' 6&/ 6'$ 6l 6&/ 6'$ wr9 $'9287 9,13 9,11 5 n 5 n 9 ''$ *1'$ 9616 5 n 5 n 9wr9 9rowdjh,qsxw
si7013 14 rev. 0.95 3. bill of materials table 9. typical application circuit bom for relative humidity and temperature measurement reference description mfr part number manufacturer r1 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel r2 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel c1 capacitor, 0.1 f, 16 v, x7r, 0603 c0603x7r160-104m venkel u1 ic, digital temper ature/humidity sens or si7013 silicon labs table 10. typical application circuit bom for thermi stor interface reference description mfr part number manufacturer r1 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel r2 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel r3 resistor, 24 k ? , 1%, 1/16w, 0603 cr0603-16w-2402f venkel r4 resistor, 24 k ? , 1%, 1/16w, 0603 cr0603-16w-2402f venkel c1 capacitor, 0.1 f, 16 v, x7r, 0603 c0603x7r160-104m venkel c2 capacitor, 0.1 f, 16 v, x7r, 0603 c0603x7r160-104m venkel th1 thermistor, 10 k ? ntcle100e3103 vishay u1 ic, digital temperature/humi dity sensor si7013 silicon labs table 11. typical application circuit bom for single ended 0 to 3 v measurement reference description mfr part number manufacturer r1 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel r2 resistor, 10 k ? , 5%, 1/16w, 0603 cr0603-16w-103jt venkel r3 resistor, 2 k ? , 1%, 1/16w, 0603 cr0603-16w-2001f venkel r4 resistor, 1 k ? , 1%, 1/16w, 0603 cr0603-16w-1001f venkel c1 capacitor, 0.1 f, 16 v, x7r, 0603 c0603x7r160-104m venkel u1 ic, digital temper ature/humidity sens or si7013 silicon labs
si7013 rev. 0.95 15 4. functional description figure 8. si7013 block diagram the si7013 is a digital relative humidity and temperature sensor that integrates temp erature and humidity sensor elements, an analog-to-digital converter, signal processing , calibration, polynomial non-linearity correction, and an i 2 c interface all in a single chip. the si7013 is individually factory-calibra ted for both temperature and humidity, with the calibration data stored in on-chip non-volat ile memory. this ensures that the sensor is fully interchangeable, with no recalibration or changes to soft ware required. patented use of industry-standard cmos and low-k dielectrics as a sensor e nables the si7013 to achieve excellent long term stabilit y and immunity to contaminants with low drift and hysteresis. the si7013 of fers a low power, high accuracy, calibrated and stable solution ideal for a wide range of temperature, humi dity, and dew-point applications including medical and instrumentation, high reliab ility automotive and industri al systems, and cost-sensi tive consumer electronics. the auxiliary sensor input option exists to use the adc with external inputs and refe rence. suitable buffers are included to allow the part to be connected to high impe dance circuitry such as bridges or other types of sensors, without introducing errors. while the si7013 is largely a conventional mixed-signal cmos integrated circuit, relative humidity sensors in general and those based on capacitive sensing using polymeric dielectrics have unique application and use requirements that are not common to conventional (non-sensor) ics. chief among those are: ?? the need to protect the sensor during board assembly, i.e., solder reflow, and the need to subsequently rehydrate the sensor. ?? the need to protect the sensor from damage or contamination during the product life-cycle. ?? the impact of prolonged exposure to extremes of temper ature and/or humidity and their potential effect on sensor accuracy. ?? the effects of humidity sensor ?memory?. each of these items is discussed in more detail in the following sections. adc gnd humidity sensor control logic scl si7013 temp sensor 1.25v ref i 2 c interface sda ad0/vout vsns vdd vinp calibration memory analog input vinn
si7013 16 rev. 0.95 4.1. relative humidi ty sensor accuracy to determine the accuracy of a relative humidity sensor, it is placed in a temperat ure and humidity controlled chamber. the temperature is set to a convenient fixed valu e (typically 25?30 c) and the relative humidity is swept from 20 to 80% and back to 20% in the following steps: 20% ? 40% ? 60% ? 80% ? 80% ? 60% ? 40% ? 20%. at each set-point, the cham ber is allowed to settle for a period of 60 minutes before a reading is taken from the sensor. prior to the sweep, the device is allowed to stabilize to 50%rh. the solid trace in figure 9 shows the result of a typical sweep. figure 9. measuring sensor accuracy including hysteresis the rh accuracy is defined as the dott ed line shown in figure 9, which is th e average of the two data points at each relative humidity set-point. in this case, the sensor shows an accuracy of 0.25%rh. the si7013 accuracy specification (table 4) includes: ?? unit-to-unit and lot-to-lot variation ?? accuracy of factory calibration ?? margin for shifts that can occur during solder reflow the accuracy specification does not include: ?? hysteresis (typically 1%) ?? effects from long term exposure to very humid conditions ?? contamination of the sensor by particulates, chemicals, etc. ?? other aging related shifts ("long-term stability") ?? variations due to temperature
si7013 rev. 0.95 17 4.2. hysteresis the moisture absorbent film (polymeric dielectric) of the humidity sensor will carry a memory of its exposure history, particularly its recent or ex treme exposure history. a sensor exposed to relative ly low humidity will carry a negative offset relative to the fact ory calibration, and a sensor exposed to relatively high humidity will carry a positive offset relative to th e factory calibration. this fact or causes a hysteresis effect illustrated by the solid trace in figure 9. the hysteresis value is the difference in %rh between the maximum absolute error on the decreasing humidity ramp and the maximum absolute error on the in creasing humidity ramp at a single relative humidity setpoint and is expressed as a bipolar quantity relative to the average error (dashed trace). in the example of figure 9, the measurement uncertainty due to the hysteresis effect is +/-1.0%rh. 4.3. prolonged expos ure to high humidity prolonged exposure to high humidity will result in a gra dual upward drift of the rh reading. the shift in sensor reading resultin g from this drift will generally disappear slowly unde r normal ambient cond itions. the amount of shift is proportional to the magnitude of relative humidi ty and the length of exposure. in the case of lengthy exposure to high humidity, some of the resulting shift may persist indefinitely under typical conditions. it is generally possible to substantially re verse this affect by baking the device (see section ?4.6. bake/hydrate procedure? ). 4.4. pcb assembly 4.4.1. soldering like most ics, si7013 devices are shipped from the fa ctory vacuum-packed with an enclosed desiccant to avoid any drift during storage and to prevent any moisture-rel ated issues during solder reflow. the following guidelines should be observed during pcb assembly: ?? si7013 devices are compatible with standard board assembly processes. devices should be soldered using reflow per the recommended card reflow profile. see section ?10. pcb land pattern and solder mask design? for the recommended card reflow profile. ?? a ?no clean? solder process is recommended to minimize the need for water or solvent rinses after soldering. cleaning after soldering is possible, bu t must be done carefully to avoid impacting the performance of the sensor. see applic ation note ?an607: si70xx humidity sensor designer?s guide? for more information on cleaning. ?? it is essential that the exposed polymer sensing film be kept clean and undamaged. this can be accomplished by careful handling and a clean, well-c ontrolled assembly process. when in doubt or for extra protection, a heat-resistant, protective cover such as kapton ?? kppd-1/8 can be installed during pcb assembly. si7013s may be ordered with a factory-fitted, solder-resis tant protective cover. this cover provides protection during pcb assembly or rework but without the time and ef fort required to install and remove the kapton tape. it can be left in place for the lifetime of the product, preventi ng liquids, dust or other contaminants from coming into contact with the polymer sensor film. see section ?8. orde ring guide? for a list of ordering part numbers that include the cover. 4.4.2. rehydration the measured humidity value w ill generally shift slightly after solder refl ow. a portion of this shift is permanent and is accounted for in the accuracy sp ecifications in table 4. after soldering, an si7013 should be allowed to equilibrate under contro lled rh conditions (room temperature, 45?55 %rh) for at least 48 hours to eliminate the remainder of the shift and return the devi ce to its specified accuracy performance.
si7013 18 rev. 0.95 4.4.3. rework to maintain the specified sensor performance, care must be taken during rework to minimize the exposure of the device to excessive heat and to avoid damage/contaminati on or a shift in the sensor reading due to liquids, solder flux, etc. manual touch-up using a soldering ir on is permissible under the following guidelines: ?? the exposed polymer sensing film must be kept clean and undamaged. a protective cover is recommended during any rework operation (kapton? tape or the factory installed cover). ?? flux must not be allowed to contaminate the sensor; liquid flux is not recommended even with a cover in place. conventional lead-free solder with rosin core is acceptable for touch-up as long as a cover is in place during the rework. ?? if possible, avoid water or solvent rinses after touch- up. cleaning after soldering is possible, but must be done carefully to avoid impacting the performance of the sensor. see an607 for more information on cleaning. ?? minimize the heating of the device. soldering iron te mperatures should not exceed 350 c and the contact time per pin should not exceed 5 seconds. ?? hot air rework is not recommended. if a device must be replaced, remove the device by hot air and solder a new part in its place by reflow following the guidelines above. *note: all trademarks are the property of their respective owners. figure 10. si70xx with factory-installed protective cover
si7013 rev. 0.95 19 4.5. protecting the sensor because the sensor operates on the pr incipal of measuring a change in capa citance, any changes to the dielectric constant of the polymer film will be detect ed as a change in relative humidity. therefore, it is important to minimize the probability of contaminants coming into contact with the sensor. dust and ot her particles as well as liquids can affect the rh reading. it is recommended that a cover is employed in the end system that blocks contaminants but allows water vapor to pass through. depending on the needs of the application, this can be as simple as plastic or metallic gauze for basic protec tion against particulates or something mo re sophisticated such as a hydrophobic membrane providing up to ip67 compliant protection. the si7013 may be ordered with a factory-fitted, solder-resist ant cover that can be left in place for the lifetime of the product. it is very low-profile, hydrophobic and oleopho bic, and excludes particulates down to 0.35 microns in size. see section ?8. ordering guide? for a list of orde ring part numbers that include the cover. a dimensioned drawing of the ic with the cover is included in section ?9. package outline ? . other characteristics of the cover are listed in table 12. table 12. specifications of protective cover parameter value material eptfe water entry pressure 2.7 bar pore size 0.35 operating temperature ?40 to 125 c maximum reflow temperature 260 c oleophobicity (aatcc 118-1992) 7 ip rating (per iec 529) ip67
si7013 20 rev. 0.95 4.6. bake/hydrate procedure after exposure to extremes of temperature and/or humi dity for prolonged periods, the polymer sensor film can become either very dry or very wet; in each case the result is either high or low relative humidity readings. under normal operating conditions, the induced error will diminish over time. from a very dry condition, such as after shipment and soldering, the error will diminish over a few days at ty pical controlled ambient conditions, e.g., 48 hours of 45 %rh 55. however, from a very wet condition, recovery may take signi ficantly longer. to accelerate recovery from a wet condition, a bak e and hydrate cycle can be implemente d. this operation consists of the following steps: ?? baking the sensor at 125 c for 12 hours ?? hydration at 30 c in 75% rh for 10 hours following this cycle, the sensor will return to normal o peration in typical ambient conditions after a few days. 4.7. long term drift/aging over long periods of time, the sensor readings may dr ift due to aging of the devic e. standard accelerated life testing of the si7013 has resulted in the specifications for long-term drift shown in table 4 and table 5. this contribution to the overall sensor accuracy accounts only for the long-term aging of the device in an otherwise benign operating environment and does not include the effe cts of damage, contamination, or exposure to extreme environmental conditions.
si7013 rev. 0.95 21 5. i 2 c interface the si7013 communicates with the host controller over a digital i 2 c interface. the 7-bit base slave address is 0x40 or 0x41; the least significant bit is pin programmable. master i 2 c devices communicate with the si7013 using a co mmand structure. the commands are listed in the i 2 c command table. commands other than those documented below are undefined and should not be sent to the device. table 13. i 2 c slave address byte a6 a5 a4 a3 a2 a1 a0 r/w 100000ad01/0 table 14. i 2 c command table command description command code measure relative humidity, hold master mode 0xe5 measure relative humidity, no hold master mode 0xf5 measure temperature, hold master mode 0xe3 measure temperature, no hold master mode 0xf3 measure analog voltage or thermistor temperature, hold master mode 0xee read temperature value from previous rh measurement 0xe0 reset 0xfe write voltage measurement setup (user register 2) 0x50 read voltage measurement setup (user register 2) 0x10 write rh/t measurement setup (user register 1) 0xe6 read rh/t measurement setup (user register 1) 0xe7 write heater setup (user register 3) 0x51 read heater setup (user register 3) 0x11 write thermistor correction coefficient 0xc5 read thermistor correction coefficient 0x84 read electronic id 1st word 0xfa 0x0f read electronic id 2nd word 0xfc 0xc9 read firmware revision 0x84 0xb8
si7013 22 rev. 0.95 5.1. issuing a measurement command the measurement commands instruct the si7013 to pe rform one of four possible measurements; relative humidity, temperature, auxiliary temp erature, or analog volt age. the procedure to issue any one of these commands is identical. while the meas urement is in progress, the option of either clock stretching (hold master mode) or not acknowledging read request s (no hold master mode) is available to indicate to the master that the measurement is in progress; the chosen command code determines which mode is used. optionally, a checksum byte can be returned from the slave for use in checking for transmission errors. the checksum byte will follow the least sign ificant measurement byte if it is acknowledg ed by the master. the checksum byte is not returned if the master ?not acknowledges? the least significant measurement byte. the checksum byte is calculated using a crc generator polynomial of x 8 + x 5 + x 4 + 1 with an initialization of 0x00. master slave sequence ? to ? perform ? a ? measurement ? and ? read ? back ? result ? (hold ? master ? mode) s slave ? address w a measure ? cmd asr slave ? address r a clock ? stretch ? during ? measure \ ment \ > ms ? byte a ls ? byte na p a checksum na p sequence ? to ? perform ? a ? measurement ? and ? read ? back ? result ? (no ? hold ? master ? mode) s slave ? address w a measure ? cmd asr slave ? address r na slave ? address r na slave ? address r a ms ? byte a ls ? byte na pa checksum na p
si7013 rev. 0.95 23 5.1.1. measuring relative humidity once a relative humidity measurement has been made, the results of the measurement may be converted to percent relative humidity by using the following expression: where: %rh is the measured relative humidity value in %rh rh code is the 16-bit word returned by the si7013 a humidity measur ement will always return xxxxxx10 in the lsb field. 5.1.2. measuring temperature each time a relative humidity measurement is made a te mperature measurement is also made for the purposes of temperature compensation of the relative humidity meas urement. if the temperature value is required, it can be read using command 0xe0; this avoids having to perf orm a second temperature measurement. the measure temperature commands 0xe3 and 0xf3 will perform a temperature measurement and retu rn the measurement value, command 0xe0 does not perform a measurement but returns the temperature value measured during the relative humidity measurement. the results of the temperature measurement may be conver ted to temperature in degrees celsius (c) using the following expression: where: temperature (c) is the measured temperature value in c temp_code is the 16-bit word returned by the si7013 a temperature measurement will always return xxxxxx00 in the lsb field. sequence ? to ? read ? temperature ? value ? from ? previous ? rh ? measurement s slave ? address w a0xe0 asr slave ? address r a ms ? byte a ls ? byte na p %rh 125 ? rh_code 65536 --------------------------------------- 6 ? = temperature ( ? c ? 175.72 ? temp_code 65536 ------------------------------------------------------- - 46.85 ? =
si7013 24 rev. 0.95 5.2. reading and wr iting user registers there are three user registers on the si7013 that allow the user to set the configuration of the si7013, the procedure for accessing these registers is set out below. 5.3. measuring analog voltage the analog voltage input pins can accept voltage inputs within the ranges shown in table 15. v refp is internally connected to v dda or to an internal 1.25 v reference voltage. the voltage conversion output is a signed 16-bit integer that will vary from ?32768 to 32767 as the input (v inp ? v inn ) goes from ?v to +v. for best performance, it is recommended that |v inp ?v inn | be limited to v ref /2. with minor degradation in performance, this can be exte nded to 0.8*vref. the checksum option for voltage mode conversions is not supported. sequence ? to ? read ? a ? register s slave ? address w a read ? reg ? cmd asr slave ? addres s r a read ? data na p sequence ? to ? write ? a ? register s slave ? address w a write ? reg ? cmd awrite ? data ap table 15. analog input ranges v inp input range vinn input range min max min max buffered input 0.5 v vdd 0.5 v vdd unbuffered input 0 v vdd 0 v vdd
si7013 rev. 0.95 25 5.4. nonlinear correct ion of voltage inputs: the si7013 contains a look-up table for applying non-linear correction to external voltage measurements. the look- up table is contained in an internal, user-programmable otp memory. the otp memory is non-volatile, meaning the values are retained even when the device is powered off. once the lookup table values have been programmed, this correction is invoked by writing a ?1? to bit 5 of user register 1. note that humidity measurements s hould not be performed when this bit is set. 5.4.1. calculating lookup table values the non-linear correction is based on 10 points. each po int consists of the ideal out put for a given expected a/d measurement result. values between the ideal output point s are interpolated based on the sl ope between the two output points. the lookup table is stored in the si7013 memory. values must be programmed for each pair of input values and ideal output points. in addition, the slope between each ideal output point must also be programmed (the si7013 will not automatically calculate the slope) . only 9 of the input/output pairs ne ed to be in the table because the 10 th output value is determined by the slope equation. the table contains 3 sets of 9 values: ?? in(1-9): 16-bit signed values for each input point re ad from the adc. see section ?5.3. measuring analog voltage? for more information on setting up the adc measurement. ?? out(1-9): 16-bit unsigned values for each ideal output point that should be used for each input point. ?? slope(1-9): 16-bit signed values for the slope between each ideal output point. note: the table must be arranged in order of decreasing input values. the slope values must be calculated as follows: slope n =256*(output n+1 ? output n )/(input n+1 ? input n ) the actual output value is determined by extrapolation: if in >in2, out = out1+slope1*(in-in1)/256 else if in >in3, out = out2+slope2*(in-in2)/256 else if in >in4, out = out3+slope3*(in-in3)/256 else if in >in5, out = out4+slope4*(in-in4)/256 else if in >in6, out = out5+slope5*(in-in5)/256 else if in >in7, out = out6+slope6*(in-in6)/256 else if in >in8, out = out7+slope7*(in-in7)/256 else if in >in9, out = out8+slope8*(in-in8)/256 else out = out9+slope9*(in-in9)
si7013 26 rev. 0.95 5.4.2. entering lookup table values into otp memory: the table is entered into memory addresses 0x82 ? 0xb7 one byte at a time. until the otp has been programmed, all memory addresses default to a value of 0xff. th e table below indicates where the values are written: the command code 0xc5 is used for programming, so fo r example, to program a si 7013 at slave address 0x40 with the 16-bit value 0x4c2f, starting at memory location 0x82, you would write: 0x40 w ack 0xc5 ack 0x82 ack 0x4c ack 0x40 w ack 0xc5 ack 0x83 ack 0x2f ack the internal memory is one-time-programmable, so it is not possible to change the values once written. however, to verify the values were written properly use command 0x84. for example, to verify that 0x4c was written to location 0x82 use 0x40 w ack 0x84 ack 0x82 ack 0x 40r ack 0x4c nack where 0x4c is the expected return value of the read transaction. table 16. lookup table memory map name memory location name memory location name memory location input1 (msb) 0x82 output1 (msb) 0x94 slope1 (msb) 0xa6 input1 (lsb) 0x83 output1 (lsb) 0x95 slope1 (lsb) 0xa7 input2 (msb) 0x84 output2 (msb) 0x96 slope2 (msb) 0xa8 input2 (lsb) 0x85 output2 (lsb) 0x97 slope2 (lsb) 0xa9 input3 (msb) 0x86 output3 (msb) 0x98 slope3 (msb) 0xaa input3 (lsb) 0x87 output3 (lsb) 0x99 slope3 (lsb) 0xab input4 (msb) 0x88 output4 (msb) 0x9a slope4 (msb) 0xac input4 (lsb) 0x89 output4 (lsb) 0x9b slope4 (lsb) 0xad input5 (msb) 0x8a output5 (msb) 0x9c slope5 (msb) 0xae input5 (lsb) 0x8b output5 (lsb) 0x9d slope5 (lsb) 0xaf input6 (msb) 0x8c output6 (msb) 0x9e slope6 (msb) 0xb0 input6 (lsb) 0x8d output6 (lsb) 0x9f slope6 (lsb) 0xb1 input7 (msb) 0x8e output7 (msb) 0xa0 slope7 (msb) 0xb2 input7 (lsb) 0x8f output7 (lsb) 0xa1 slope7 (lsb) 0xb3 input8 (msb) 0x90 output8 (msb) 0xa2 slope8 (msb) 0xb4 input8 (lsb) 0x91 output8 (lsb) 0xa3 slope8 (lsb) 0xb5 input9 (msb) 0x92 output9 (msb) 0xa4 slope9 (msb) 0xb6 input9 (lsb) 0x93 output9 (lsb) 0xa5 slope9 (lsb) 0xb7
si7013 rev. 0.95 27 5.4.3. example thermistor calculations for the si7013 evaluation board with a 10 k ohm thermist or and two 24.3 k ohm bias resistors and assuming the a/d conversion is done using vd d as a reference with buffered inputs, the ideal input voltage versus temperature is: vin = v dd *rthemistor/(rthermisor+46.4 k) since v dd is also the reference then the ex pected a/d conversion result is: a/d counts = 32768* rthemistor/(rthermisor+46.4 k) if it is desired to linearize this result for the same temperature representation as the on board temperature sensor: temperature c = (output_code*175.72/65536 ? 46.85), then the desired output code is: output_code = 65536*(temperature+46.85)/175.72 using thermistor data sheet values of resistance versus temperature and choosing to linearize at the points ?15c, ?5c, 5c, 15c, 25c, 35c, 45c, 55c, 65c and 75c results in the following. the values in gray are the table entries for si7013: table 17. example non-linear correction to thermistor voltage measurements temperature (degrees c) thermistor resistance vin/vdd a/d codes desired code slope table entry ?15 71746 0.596164 19535 11879 ?218 1 ?5 41813 0.462467 15154 15608 ?241 2 5 25194 0.34141 11187 19338 ?298 3 15 15651 0.243592 7982 23067 ?400 4 25 10000 0.170648 5592 26797 ?563 5 35 6556 0.118863 3895 30527 ?813 6 45 4401 0.83036 2721 34256 ?1186 7 55 3019 0.058486 1916 37986 ?1739 8 65 2115 0.041704 1367 41715 ?2513 9 75 1509 0.030114 75 45445
si7013 28 rev. 0.95 once the table entry values are calculated, they should be programmed to the si7013 memory locations as shown below: table 18. example non-linear thermistor correction entries into si7013 memory memory location a/d codes value memory location desired codes value memory location slope value 82 19535 4c 94 11879 2e a6 ?218 ff 83 4f 95 67 a7 26 84 15154 3b 96 15608 3c a8 ?241 ff 85 32 97 f8 a9 0f 86 11187 2b 98 19338 4b aa ?298 fe 87 b3 99 8a ab d6 88 7982 1f 9a 23067 5a ac ?400 fe 89 2e 9b 1b ad 70 8a 5592 15 9c 26797 68 ae ?563 fd 8b d8 9d ad af cd 8c 3895 f 9e 30527 77 b0 ?813 fc 8d 37 9f 3f b1 d3 8e 2721 a a0 34256 85 b2 ?1186 fb 8f a1 a1 d0 b3 5e 90 1916 7 a2 37986 94 b4 ?1739 f9 91 7c a3 62 b5 35 92 1367 5 a4 41715 a2 b6 ?2513 f6 93 57 a5 f3 b7 2f
si7013 rev. 0.95 29 5.5. firmware revision the internal firmware revision can be read with the following i2c transaction: the upper nibble of the fwrev byte corresponds to the ma jor firmware revision number, while the lower nibble of the fwrev byte corresponds to the minor firmware revisi on number. therefore, firmware revision 1.0 would be encoded as 0x10 in the fwrev byte. 5.6. heater the si7013 contains an integrated resi stive heating element that may be used to raise the temperature of the sensor. this element can be used to test the sensor, to drive off condensation, or to implement dew-point measurement when the si7013 is used in conjunction with a separate temperature sensor such as another si7013 (the heater will raise the temperature of the intern al temperat ure sensor). the heater can be activated using heater [2:0], the three least-significant bits in user register 3. turning on the heater will reduce the tendency of the humidity sensor to accumulate an offs et due to "memory" of sustained high humidity conditions. five different power levels are av ailable. the various settings are described in table 18. s slave ? address w a0x84 a0xb8 as slave ? address r a fwrev a na p table 19. heater control settings heater[3:0] typical current draw * (ma) 0000 3.09 0001 9.18 0010 15.24 ... ... 0100 27.39 ... ... 1000 51.69 ... ... 1111 94.20 *note: assumes vdd = 3.3 v.
si7013 30 rev. 0.95 5.7. electronic serial number the si7013 provides a serial number individualiz ed for each device that can be read via the i 2 c serial interface. two i 2 c commands are required to access the device memory and retrieve the complete serial number. the command sequence, and format of the serial numb er response is described in the figure below: first access: the format of the complete serial number is 64-bits in length, divided into 8 data bytes. the complete serial number sequence is shown below: the snb3 field contains the device identification to distin guish between the different s ilicon labs relative humidity and temperature devices. the value of this field maps to the following devices according to this table: 0x00 or 0xff engineering samples 0x0d=13=si7013 0x14=20=si7020 0x15=21=si7021 master slave sslave ? address w ack 0x3a ack 0x0f ack sslave ? address r ack sna_3 ack crc ack sna_2 ack crc ack sna_1 ack crc ack sna_0 ack crc nack p 2nd access: sslave ? address w ack 0x3c ack 0x09 ack sslave ? address r ack snb_3 ack snb_2 ack crc ack snb_1 ack snb_0 ack crc nack p sna_3 sna_2 sna_1 sna_0 snb_3 snb_2 snb_1 snb_0
si7013 rev. 0.95 31 6. control registers table 20. register summary register bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 user register 1 res1 vdds rsvd htre rsvd res0 user register 2 measure _mode1 measure_ mode0 conv_ time rsvd vin_buf vrefp vout user register 3 rsvd heater[3:0] notes: 1. any register not listed here is reserved and must not be written.the result of a read operation on these registers is undefined. 2. except where noted, reserved register bits must always be written as zero; the result of a read operation on these bits is undefined.
si7013 32 rev. 0.95 6.1. register descriptions reset settings = 0011_1010 reset settings = 0000_100x register 1. user register 1 bit d7 d6 d5 d4d3d2 d1 d0 name res1 vdds rsvd htre rsvd res0 type r/w r r/w r/w r/w r/w bit name function d7; d0 res[1:0] measurement resolution: rh temp 00: 12 bit 14 bit 01: 8 bit 12 bit 10: 10 bit 13 bit 11: 11 bit 11 bit d6 vdds vdd status: 0: v dd ok 1: v dd low the minimum recommended operating voltage is 1.9 v. a transi- tion of the vdd status bit from 0 to 1 indicates that vdd is between 1.8 v and 1.9 v. if the vdd drops below 1.8 v, the device will no longer operate correctly. d5, d4, d3 rsvd reserved d2 htre 1=on-chip heater enable 0=on-chip heater disable d1 rsvd reserved register 2. user register 2 bitd7d6 d5 d4d3d2d1d0 name rsvd measure_ mode1 measure_ mode0 conv_ time rsvd vin_buf vrefp vout type r/w r/w r/w r/w r/w r/w r/w r/w
si7013 rev. 0.95 33 bit name function d7 rsvd reserved d6:d5 measure_mode [1:0] measurement mode. selects the mode of the voltage measurement function. note: if no hold master mode is sele cted, all commands are no hold. d4 conv_time conversion time. selects conversion time and noise floor of the voltage adc. d3 rsvd reserved d2 vin_buf 0: vinn and vinp inputs are unbuffered 1: vinn and vinp inputs are buffered d1 vrefp 0: a/d reference so urce is internal 1.25v 1: a/d reference source is vdda d0 vout* 0: vout pin is set to gndd 1: vout pin is set to vddd note: default is powerup state of vout pin *note: vout is generally used for driving an external thermistor interface. default setting is the same as the power up setting. d6 d5 function 0 0 voltage measurement hold master mode without thermistor correction. this is the recommended mode when temperature or humidity measure- ments are done. 0 1 voltage measurement hold master mode with thermistor correction. no humidity or internal tem- perature measurements are allowed in this mode. 1 0 voltage measurement no hold master mode with no thermistor correction. 1 1 voltage measurement no hold master mode with thermistor correction. no humidity or internal tem- perature measurements are allowed in this mode. 0 conversion time 7 ms max noise floor 25 v typical with v ref =1.25v. 1 conversion time 3.1 ms max noise floor 50 v typical with v ref =1.25v.
si7013 34 rev. 0.95 reset settings = 0000_0000 register 3. user register 3 bitd7d6d5d4d3d2d1 d0 name rsvd heater [3:0] type r/w r/w bit name function d3:d0 heater[3:0] d3 d2 d1 d0 heater current 0000 3.09 ma 0001 9.18 ma 0010 15.24 ma ... 0100 27.39 ma ... 1000 51.69 ma ... 1 1 1 1 94.20 ma d7,d6, d5,d4 rsvd reserved
si7013 rev. 0.95 35 7. pin descriptions: si7013 (top view) pin name pin # pin description sda 1 i 2 c data. ad0/vout 2 dual function pin. this pin can be switched high or low and is generally used to drive an external thermistor interface. on powerup, this pin acts as a device addres s select pin. tie high or low to set device address lsb. see figure 5 and figure 6. gndd 3 digital ground. this pin is connected to ground on the circuit board. gnda 4 analog ground. this pin is connected to ground on the circuit board. vsns 5 voltage sense input. tie to vdd.* vinp 6 analog to digital converter positive input. vinn 7 analog to digital converter negative input. vdda 8 analog power. this pin is connected to power on the circuit board. vddd 9 digital power. this pin is con nected to power on the circuit board. scl 10 i 2 c clock t gnd paddle this pad is connected to gnd internally. this pad is t he main thermal input to the on- chip temperature sensor . the paddle should be soldered to a floating pad. *note: vsns must be high at power up or device will be held in reset. sda gndd vsns ad0/vout gnda vinp vddd scl vinn vdda 1 2 3 4 56 7 8 9 10
si7013 36 rev. 0.95 8. ordering guide table 21. device ordering guide p/n description max. accuracy pkg operating range (c) protective cover packing format temp rh si7013-a10-gm digital temperature/ humidity s ensor 0.4 c 3% dfn 6 ?40 to +85 c n tube si7013-a10-gmr digital temperature/ humidity s ensor 0.4 c 3% dfn 6 ?40 to +85 c n tape & reel si7013-a10-gm1 digital temperature/ humidity sens or 0.4 c 3% dfn 6 ?40 to +85 c y cut tape SI7013-A10-GM1R digital temperature/ humidity s ensor 0.4 c 3% dfn 6 ?40 to +85 c y tape & reel si7013-a10-im digital temper ature/ humidity sensor? industrial temp range 0.4 c 3% dfn 6 ?40 to +125 c n tube si7013-a10-imr digital temper ature/ humidity sensor? industrial temp range 0.4 c 3% dfn 6 ?40 to +125 c n tape & reel si7013-a10-im1 digital temper ature/ humidity sensor? industrial temp range 0.4 c 3% dfn 6 ?40 to +125 c y cut tape si7013-a10-im1r digital temper ature/ humidity sensor? industrial temp range 0.4 c 3% dfn 6 ?40 to +125 c y tape & reel si7013-a10-ym digital temper ature/ humidity sensor? automotive 0.4 c 3% dfn 6 ?40 to +125 c n tube si7013-a10-ymr digital temper ature/ humidity sensor? automotive 0.4 c 3% dfn 6 ?40 to +125 c n tape & reel si7013-a10-ym1 digital temper ature/ humidity sensor? automotive 0.4 c 3% dfn 6 ?40 to +125 c y cut tape si7013-a10-ym1r digital temper ature/ humidity sensor? automotive 0.4 c 3% dfn 6 ?40 to +125 c y tape & reel
si7013 rev. 0.95 37 9. package outline 9.1. package outline: 3x3 10-pin dfn figure 11 illustrates the package details for the si7013. table 21 lists the val ues for the dimensions shown in the illustration. figure 11. 10-pin dfn package drawing table 22. 10-pin dfn package dimensions dimension min nom max dimension min nom max a 0.70 0.75 0.80 h2 1.39 1.44 1.49 a1 0.00 0.02 0.05 l 0.50 0.55 0.60 b 0.18 0.25 0.30 aaa 0.10 d 3.00 bsc. bbb 0.10 d2 1.20 1.30 1.40 ccc 0.05 e 0.50 bsc. ddd 0.10 e 3.00 bsc. eee 0.05 e2 2.40 2.50 2.60 fff 0.05 h1 0.85 0.90 0.95 notes: 1. dimensioning and tolerancing per ansi y14.5m-1994. 2. recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. ?
si7013 38 rev. 0.95 9.2. package outline: 3x3 10-pi n dfn with protective cover figure 12 illustrates the package details for the si7013 with the optional protective cove r. table 22 lists the values for the dimensions shown in the illustration. figure 12. 10-pin dfn with protective cover table 23. 10-pin dfn with protective cover diagram dimensions dimension min nom max dimension min nom max a ? ? 1.21 f1 2.80 2.85 2.90 a1 0.00 0.02 0.05 f2 2.80 2.85 2.90 a2 0.70 0.75 0.80 h 0.76 0.83 0.90 b 0.18 0.25 0.30 l 0.50 0.55 0.60 d 3.00 bsc. r1 0.45 0.50 0.55 d2 1.20 1.30 1.40 aaa 0.10 e 0.50 bsc. bbb 0.10 e 3.00 bsc. ccc 0.05 e2 2.40 2.50 2.60 ddd 0.10 eee 0.05 notes: 1. all dimensions shown ar e in millimeters (mm). 2. dimensioning and tolerancing per ansi y14.5m-1994.
si7013 rev. 0.95 39 10. pcb land pattern and solder mask design table 24. pcb land pattern dimensions symbol mm c1 2.80 e0.50 p1 1.40 p2 2.60 x1 0.30 y1 1.00 notes: general 1. all dimensions shown are at maximum material condition (mmc). least material condition (lmc) is calculated based on a fabrication allowance of 0.05 mm. 2. this land pattern design is based on the ipc-7351 guidelines. solder mask design 3. all metal pads are to be non-solder mask defined (nsmd). clearance between the solder mask and the metal pad is to be 60 m minimum, all the way around the pad. stencil design 4. a stainless steel, laser-cut and electro-pol ished stencil with trapezoidal walls should be used to assure good solder paste release. 5. the stencil thickness should be 0.125 mm (5 mils). 6. the ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins. 7. a 2x1 array of 0.95 mm square openings on 1.25 mm pitch should be used for the center ground pad to achieve a target solder coverage of 50%. card assembly 8. a no-clean, type-3 solder paste is recommended. 9. the recommended card reflow profile is per the jedec/ipc j-std-020 specification for small body components. ?
si7013 40 rev. 0.95 11. top marking 11.1. si7013 top marking 11.2. top marking explanation mark method: laser pin 1 indicator: circle = 0.30 mm diameter upper-left corner font size: 0.30 mm line 1 marking: tttt = mfg code
si7013 rev. 0.95 41 12. additional reference resources ?? an607: si70xx humidity sensor designer?s guide
si7013 rev. 0.95 42 d ocument c hange l ist revision 0.1 to revision 0.6 ? updates to section 1. el ectrical specifications. ? updated table 2. general specifications. ? updated figure 1. i2c interface timing diagram. ? updated table 6. voltage converter specifications. ? updated table 7. thermal characteristics. ? updated section 2. typica l applications circuits. ? updated figure 5. typica l application circuit for thermistor interface with ad0 = 1. ? updated table 15. i2c command table. ? updated section 4.4 pcb assembly. ? updated section 5.3 measuring relative humidity. ? updated section 5.4 measuring temperature. ? updated section 5.6 nonlinear correction of voltage inputs. ? updated section 5.7 heater. ? removed section 5.8 device identification and added device identification information to section 5.9. ? updated section 6. control registers. ? updated section 9. package outline. ? updated section 11. top marking. revision 0.6 to revision 0.95 ? updated table 1. recommended operating conditions ? updated table 2. general specifications ? updated table 3. i2c interface specifications ? updated table 4 humidity sensor ? updated table 5. temperature sensor ? updated table 8. absolu te maximum ratings ? updated figure 5. typical application circuit for thermistor interface with ad0 = 1 ? updated figure 6. typical application circuit for thermistor interface with ad0 = 0 ? updated figure 8. si7013 block diagram ? updated section 4.1. relative humidity sensor accuracy ? updated section 4.4.1. soldering ? updated table 15. analog input ranges ? updated section 5.1. issuing a measurement command ? updated section 5.2. reading and writing user registers ? updated section 5.4. nonlinear correction of voltage inputs ? added section 5.5. firmware revision ? updated section 6. control registers ? updated table 21. device ordering guide
si7013 rev. 0.95 43 c ontact i nformation silicon laboratories inc. 400 west cesar chavez austin, tx 78701 tel: 1+(512) 416-8500 fax: 1+(512) 416-9669 toll free: 1+(877) 444-3032 please visit the silicon labs technical support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. patent notice silicon labs invests in research and development to help our cust omers differentiate in the market with innovative low-power, s mall size, analog- intensive mixed-signal soluti ons. silicon labs' extensive pat ent portfolio is a testament to our unique approach and world-clas s engineering team. silicon laboratories and silicon labs are trademarks of silicon laboratories inc. other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. the information in this document is believed to be accurate in all respects at the time of publ ication but is subject to change without notice. silicon laboratories assumes no responsibili ty for errors and omissions, and disclaim s responsibility for any consequences resu lting from the use of information included herein. a dditionally, silicon laboratorie s assumes no responsibility for the functioning of und escribed fea- tures or parameters. silicon laboratories reserves the right to make changes without further notice. silicon laboratories makes no warran- ty, representation or guarantee regarding t he suitability of its products for any par ticular purpose, nor does silicon laborato ries assume any liability arising out of the application or use of any product or circuit, and specif ically disclaims any and all liability, in cluding without limitation consequential or incidental damages . silicon laboratories products are not designed, intended, or authorized for use in applica tions intend- ed to support or sustain life, or for any other application in which the failure of the silicon laboratories product could crea te a situation where personal injury or death may occur. should buyer purchase or us e silicon laboratories products for any such unintended or unaut horized application, buyer shall indemnify and hold silicon laboratories harmle ss against all claims and damages.

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